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暫時性貼合雷射剝離系統
Laser Debonding System for Temporary Bonding

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Features

  1. IBM High-End Temporary Bonding and DPSS Laser Debonding Technology Transfer

  2. Low-Power Laser with Carefully Selected Wavelength to Avoid Wafer Damage

  3. Compatible with Substrates with Larger Curvature

  4. Laser Combined with Special Resistant and High-Temperature Release Layers, the release layer can be matched with various adhesive layers.

  5. High-Performance Laser with Low Maintenance Cost

  6. Multiple carrier options

  7. Automated Transfer/Seperation/Placement

  8. Optimized Cleaning Module

  9. Optional Automated Optical Alignment System

  10. Complete SECS/GEM Integration Solution

Application

  • 2.5D/3D IC TSV

  • 400G Optical Transceiver

  • CoWoS

  • Wafer & Panel Fan Out level packaging

  • AP/Memory PoP

  • Power device

  • 5G applications

  • RF Module

  • Wafer Thinning

  • Blue LED

  • Red LED

  • Micro LED

  • Mini LED

  • CIS BSI

  • III-V semiconductor

  • Vertical LED

  • Thin glass transfer

  • TGV

Specifications

The equipment is suitable for circular workpieces of various sizes, including 2", 4", 6", 8", and 12". For detailed specifications, please contact KYO by phone.

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