暫時性貼合雷射剝離系統
Laser Debonding System for Temporary Bonding
Features
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IBM High-End Temporary Bonding and DPSS Laser Debonding Technology Transfer
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Low-Power, Carefully Selected Laser Wavelength to Avoid Thermal Impact and Laser Damage
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Suitable for Substrates with Relatively Large Curvature
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Laser Combined with Special Resistant and High-Temperature Release Layers, the release layer can be matched with various adhesive layers.
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High-Performance Laser with Low Maintenance Cost
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Multiple carrier options
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Optional Substrate and Carrier Separation System
Application
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2.5D/3D IC TSV
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400G Optical Transceiver
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CoWoS
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Wafer Fan Out level packaging
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AP/Memory PoP
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Power device
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5G applications
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RF Module
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Wafer Thinning
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Flash
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Blue LED
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Red LED
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Micro LED
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Mini LED
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CIS BSI
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III-V semiconductor
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Vertical LED
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Thin glass transfer
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TGV
Specifications
The equipment is suitable for circular workpieces of various sizes, including 2", 4", 6", 8", and 12". For detailed specifications, please contact KYO by phone.