暫時性貼合雷射剝離系統
Laser Debonding System for Temporary Bonding
Features
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IBM High-End Temporary Bonding and DPSS Laser Debonding Technology Transfer
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Low-Power Laser with Carefully Selected Wavelength to Avoid Wafer Damage
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Compatible with Substrates with Larger Curvature
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Laser Combined with Special Resistant and High-Temperature Release Layers, the release layer can be matched with various adhesive layers.
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High-Performance Laser with Low Maintenance Cost
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Multiple carrier options
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Automated Transfer/Seperation/Placement
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Optimized Cleaning Module
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Optional Automated Optical Alignment System
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Complete SECS/GEM Integration Solution
Applications
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2.5D/3D IC TSV
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400 G Optical Transceiver
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Power device
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5G application
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RF Module
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Wafer thinning
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Flexible OLED/LCD
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CIS BSI
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Buildup Substrate
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Flexible thin-film substrate transfer (for Micro LED/ mini LED)
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Thin glass transfer
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Large-scale Touch on Lens (TOL)
Specifications
The equipment is suitable for rectangular workpieces with dimensions such as 300X300, 370X470, 510X515, 550X550, and others. For detailed specifications, please contact KYO by phone.