暫時性貼合雷射剝離系統
Laser Debonding System for Temporary Bonding
Features
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IBM High-End Temporary Bonding and DPSS Laser Debonding Technology Transfer
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Low-Power, Carefully Selected Laser Wavelength to Avoid Wafer Damage
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Suitable for Substrates with Larger Curvature, Thin Substrate Handling
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Laser Combined with Special Resistant and High-Temperature Release Layers, Compatible with Various Adhesive Layers
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High-Performance Laser with Low Maintenance Cost
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multiple carrier options
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Optional Substrate and Carrier Separation System
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Thin Object Transfer
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Compatible with Clean Module
Applications
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2.5D/3D IC TSV
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400 G Optical Transceiver
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Power Devices
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5G Applications
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RF Module
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Wafer Thinning
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Flexible OLED/LCD
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CIS BSI
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Buildup Substrate
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Flexible Thin Film Substrate Transfer (for Micro LED/Mini LED)
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Thin Glass Transfer
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Large-scale Touch on Lens (TOL)
Specifications
The equipment is suitable for rectangular workpieces of various sizes, including 300X300, 370X470, 510X515, 550X550, and more. For detailed specifications, please contact KYO by phone.